日月光投控投資 31 億美元興建新晶片廠
ASE Technology Invests $3.1 Billion in New Chip Facility
2026年4月，全球領先的晶片封裝與測試公司日月光投控（ASE Technology）宣布了一項高達新台幣1000億元（約合31.5億美元）的龐大投資計畫，將在台灣高雄興建一座尖端廠房。
In April 2026, ASE Technology, the world’s leading chip assembly and testing firm, announced a massive NT$100 billion investment—roughly US$3.15 billion—to build a new state-of-the-art facility in Kaohsiung, Taiwan.
此舉旨在解決當前阻礙人工智慧硬體快速擴張的關鍵供應鏈瓶頸。
This move aims to resolve critical supply chain bottlenecks currently hindering the rapid expansion of artificial intelligence hardware.
高層主管表示，AI產業目前仍處於萌芽期，並指出硬體生產是目前產業發展的主要制約因素。
Executives describe the AI sector as being in its infancy, noting that hardware production is now the main constraint for industry growth.
該項目聚焦於先進封裝技術，例如對增強AI數據中心數據傳輸速度至關重要的「共同封裝光學元件」（Co-Packaged Optics）。
The project focuses on advanced packaging technologies, such as Co-Packaged Optics, which are vital for enhancing data speeds in AI data centers.
作為輝達（Nvidia）和超微（AMD）等產業巨頭的關鍵合作夥伴，日月光正積極擴展營運規模，僅在2026年就計畫在全球興建六座新工廠。
As a key partner to industry giants like Nvidia and AMD, ASE is aggressively scaling its operations, planning the construction of six new factories globally in 2026 alone.
這項破紀錄的投資凸顯了該公司克服技術瓶頸並滿足全球對高效能AI硬體飆升需求的承諾。
This record-breaking investment underscores the company's commitment to overcoming technological limits and meeting the surging global demand for high-performance AI hardware.
