台積電再投資 1,000 億美元於美國晶片廠
TSMC Invests $100 Billion More in U.S. Chip Factories
Updated at: July 29, 2026 at 02:30 AM
2026年7月16日，台積電（TSMC）做出了一項歷史性的決定，宣布再加碼1000億美元的投資，以擴展其在美國亞利桑那州的晶片製造業務。
On July 16, 2026, Taiwan Semiconductor Manufacturing Co.
這項承諾使台積電在美國設施的總投資額達到史無前例的2650億美元，成為美國歷史上規模最大的外國直接投資。
(TSMC) made a historic move by announcing an additional $100 billion investment to expand its chip manufacturing operations in Arizona.
這筆新資金將支持建設四座先進的半導體晶圓廠及封裝設施。
This pledge increases TSMC’s total commitment to U.S. facilities to an unprecedented $265 billion, marking the largest foreign direct investment in American history.
此次大規模擴張主要是受到對高效能晶片需求的激增所推動，特別是那些對於人工智慧（AI）產業至關重要的晶片。
The new funding will support the construction of four additional advanced semiconductor fabrication plants and packaging facilities.
透過強化其在美國的佈局，台積電旨在更好地服務蘋果（Apple）、輝達（Nvidia）和亞馬遜網路服務（AWS）等主要科技夥伴，同時協助穩定全球供應鏈。
This massive expansion is primarily fueled by the surging demand for high-performance chips, specifically those essential for the artificial intelligence industry.
在《晶片與科學法案》（CHIPS and Science Act）的支持下，該倡議預計將創造數以萬計的工作機會，並建立一個強健的國內半導體生態系統。
By bolstering its presence in the U.S., TSMC aims to better serve major technology partners like Apple, Nvidia, and Amazon Web Services, while helping to stabilize the global supply chain.
隨著台積電計畫導入其最先進的生產製程，包括3奈米和2奈米晶片製造，亞利桑那州的廠區勢必將成為美國科技的基石，減少對海外生產的依賴，並確保該國人工智慧供應鏈的未來。
Supported by the CHIPS and Science Act, this initiative is expected to create tens of thousands of jobs and build a robust domestic semiconductor ecosystem.
