日月光投控斥資 30 億美元在台興建新晶片廠
ASE Technology Invests $3 Billion in New Taiwan Chip Facility
日月光投控是全球最大的積體電路封裝與測試服務供應商，近期在臺灣高雄啟動了一項耗資34億美元的標竿性專案。
ASE Technology, the world's largest provider of IC packaging and testing services, has broken ground on a monumental $3.4 billion project in Kaohsiung, Taiwan.
該廠區位於仁武產業園區，象徵著其為緩解全球人工智慧供應鏈瓶頸所做的策略性佈局。
Located in the Renwu Industrial Park, this advanced facility represents a strategic push to alleviate bottlenecks in the global AI supply chain.
隨著對人工智慧與高效能運算晶片的需求激增，日月光正積極行動，確保關鍵的後段服務（封裝與測試）能跟上台積電等生產龍頭的腳步。
As demand for AI and high-performance computing (HPC) chips surges, ASE is stepping up to ensure that critical back-end services—packaging and testing—can keep pace with production leaders like TSMC.
此項與穎崴科技及宏騰自動化等夥伴合作的計畫，預計於2027年投產。
The project, which includes partnerships with WinWay Technology and Horng Terng Automation, is expected to start operations in 2027.
除了擴大產能，該廠更成為未來產業的模範，整合了人工智慧驅動的智慧製造與全自動化物料搬運系統。
Beyond sheer capacity, the plant serves as a model for the future of industry, integrating AI-driven smart manufacturing with fully automated material handling.
此項投資是2026年全球資本支出預算中破紀錄的70億美元中的一環，更進一步鞏固了臺灣作為現代半導體產業核心脈動的關鍵地位。
This investment, part of a record-breaking $7 billion global capital expenditure budget for 2026, reinforces Taiwan’s central role as the heartbeat of the modern semiconductor industry.
