ASE Technology Invests $3 Billion in New Taiwan Chip Facility
日月光投控斥資 30 億美元在台興建新晶片廠
ASE Technology, the world's largest provider of IC packaging and testing services, has broken ground on a monumental $3.4 billion project in Kaohsiung, Taiwan.
日月光投控是全球最大的積體電路封裝與測試服務供應商，近期在臺灣高雄啟動了一項耗資34億美元的標竿性專案。
Located in the Renwu Industrial Park, this advanced facility represents a strategic push to alleviate bottlenecks in the global AI supply chain.
該廠區位於仁武產業園區，象徵著其為緩解全球人工智慧供應鏈瓶頸所做的策略性佈局。
As demand for AI and high-performance computing (HPC) chips surges, ASE is stepping up to ensure that critical back-end services—packaging and testing—can keep pace with production leaders like TSMC.
隨著對人工智慧與高效能運算晶片的需求激增，日月光正積極行動，確保關鍵的後段服務（封裝與測試）能跟上台積電等生產龍頭的腳步。
The project, which includes partnerships with WinWay Technology and Horng Terng Automation, is expected to start operations in 2027.
此項與穎崴科技及宏騰自動化等夥伴合作的計畫，預計於2027年投產。
Beyond sheer capacity, the plant serves as a model for the future of industry, integrating AI-driven smart manufacturing with fully automated material handling.
除了擴大產能，該廠更成為未來產業的模範，整合了人工智慧驅動的智慧製造與全自動化物料搬運系統。
This investment, part of a record-breaking $7 billion global capital expenditure budget for 2026, reinforces Taiwan’s central role as the heartbeat of the modern semiconductor industry.
此項投資是2026年全球資本支出預算中破紀錄的70億美元中的一環，更進一步鞏固了臺灣作為現代半導體產業核心脈動的關鍵地位。
