新型電漿技術推動電腦晶片生產進展
New Plasma Technique Advances Computer Chip Production
Updated at: June 18, 2026 at 03:30 AM
當矽到達其物理極限時，半導體產業正推動進入一個精密的新時代。
As silicon reaches its physical limits, the semiconductor industry is pushing into a new era of precision.
電漿技術的兩項近期突破正協助延續摩爾定律，實現了下一代晶片的製造。
Two recent breakthroughs in plasma technology are helping to keep Moore’s Law alive, enabling the creation of next-generation chips.
普林斯頓電漿物理實驗室(PPPL)的研究人員正在解決過渡金屬二硫族化合物(TMDs)（如二硫化鉬(MoS₂)）進行原子級蝕刻的挑戰。
Researchers at the Princeton Plasma Physics Laboratory (PPPL) are tackling the challenge of atomic-scale etching on transition metal dichalcogenides (TMDs) like molybdenum disulfide (MoS₂).
這項技術為可能最終取代矽的超薄電子產品提供了必要的控制。
This technique provides the control necessary for ultra-thin electronics that could eventually replace silicon.
同時，科林研發(Lam Research)推出了其DirectDrive®技術，這是電漿蝕刻領域的工業飛躍。
Meanwhile, Lam Research has introduced its DirectDrive® technology, an industrial leap in plasma etching.
該系統利用高速脈衝射頻(RF)能量來實現埃級精度，這對於構建現代人工智慧(AI)所需的密集、複雜的3D結構至關重要。
This system uses high-speed, pulsed RF energy to achieve angstrom-level precision, which is vital for building the dense, complex 3D structures required for modern AI.
從分子級化學到高頻工業控制，這兩項進展對於運算未來至關重要。
These dual advancements, ranging from molecular-level chemistry to high-frequency industrial control, are essential for the future of computing.
