IBM 發表突破性的 0.7 奈米晶片技術
IBM reveals groundbreaking 0.7nm chip technology
Updated at: June 26, 2026 at 03:00 AM
2026年6月25日，IBM宣布在半導體技術上取得重大飛躍，揭幕了全球首款0.7nm（7埃）晶片技術。
On June 25, 2026, IBM announced a major leap in semiconductor technology by unveiling the world's first 0.7nm (7-angstrom) chip technology.
儘管這項突破目前尚處於IBM位於紐約州奧爾巴尼設施的研究階段，但該公司預計在未來五年內實現商業化生產。
While this breakthrough is currently in the research stage at IBM's facility in Albany, New York, the company envisions commercial production within the next five years.
其核心創新在於「奈米堆疊」(nanostack)架構，這是一種透過垂直堆疊電晶體而非水平縮小尺寸的3D設計。
The core innovation is the 'nanostack' architecture, a 3D design that vertically stacks transistors rather than shrinking them horizontally.
憑藉在一塊微小晶片上封裝近1000億個電晶體，這項技術與IBM的2nm晶片相比，有望提升高達50%的效能或70%的能源效率。
With nearly 100 billion transistors packed onto a tiny chip, this technology promises up to 50% higher performance or 70% greater energy efficiency compared to IBM's 2nm chips.
這些進步對於生成式AI的永續性至關重要，因為它需要巨大的運算能力。
These advancements are crucial for the sustainability of generative AI, which demands immense computational power.
透過賦能更高效的資料中心並支援下一代電子裝置，奈米堆疊架構證明了摩爾定律依然充滿活力。
By enabling more efficient data centers and supporting next-generation electronic devices, the nanostack architecture demonstrates that Moore's Law remains alive and well.
